System and method of providing computer resources

ABSTRACT

A data center system can include a mobile support structure; one or more enclosures for removable electronic equipment where the enclosures are housed by the support structure; a cooling system in fluid communication with the enclosures for cooling of the electronic equipment where the cooling system is housed by the support structure; and a power system operably connected to the electronic equipment and the cooling system for supplying power thereto where the power system comprises a generator housed by the support system. The mobile data center can be moved to remote locations, and the electronic equipment can be placed in communication with a network when at the remote location. Other embodiments are disclosed.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application claims priority to and the benefit of U.S. patentapplication Ser. No. 12/626,278 filed on Nov. 25, 2009. The '278application is a non-provisional application of U.S. Provisional Patentapplication Ser. No. 61/119,980 filed on Dec. 4, 2008, the disclosure ofwhich is hereby incorporated by reference.

The '278 application is related to co-pending U.S. patent applicationSer. No. 12/626,299 entitled “Apparatus and Method of EnvironmentalCondition Management for Electronic Equipment” and filed Nov. 25, 2009,the disclosure of which is hereby incorporated by reference.

FIELD OF THE INVENTION

The present application relates to providing computer resources, andparticularly to a system and method for achieving the desiredenvironmental conditions for servers and other computing devices.

BACKGROUND

Data centers are facilities for housing electronic equipment, such asservers. A data center can occupy one room of a building, one or morefloors, or an entire building. These facilities often have a largefootprint due to the various components necessary for maintaining thefacilities, including cooling equipment. Most of the equipment is oftenin the form of servers mounted in 19 inch rack cabinets, which aretypically placed in single rows forming corridors between them. Thisallows people access to the front and rear of each cabinet. Serversdiffer greatly in size from 1 U servers to large freestanding storagesilos which occupy many tiles on the floor. Some electronic equipment,such as mainframe computers and storage devices, are often as big as theracks themselves, and are placed alongside them. Local building codescan affect the footprint of the facility and thus the overall cost ofmaintaining the electronic equipment.

Cooling of server racks and cabinets in the facilities can beproblematic, particularly as processors typically produce large amountsof heat. It has been found that for every 1 watt of power used forInformation Technology, 0.5 to 2 watts of power are used for cooling theelectronic components, and thus the need for cooling uses a very highpercentage of the total IT power consumption.

The power dissipation of high-performance CPU processors is predicted toexceed 150 W in the near future. The high-density packing of servers andthe desire for lower CPU junction temperatures to achieve higherreliability of components means that thermal management of server racksis an increasing concern. Various solutions have been proposed, many ofwhich involve large numbers of fans to keep a constant airflow over theelectronic components. However, such solutions suffer from drawbacksassociated with the power supply needed to power the fans, as well asreliability of such fans. Moreover, these are generally located in largefacilities which further exacerbates the drawbacks.

In a number of solutions, server cabinets are placed on a false floorwith cool air from an HV AC system being supplied through the falsefloor to a vent in front of the cabinet. The cooling airflow is thendrawn front-to-back through the cabinet using fans, and vented out tothe back of the cabinet. With such arrangements, it is desirable to usea “hot-aisle/cold-aisle” arrangement so that server fronts are arrangedfacing one another so that two aisles can draw cool air from a singlevent area, and so that the server backs also face one another. The hotair is then allowed to vent to air return units in the ceiling. This canlead to “hot spots” in the server room; however, much of the hot air canalso mix with the cool air circulating in the room. Various solutions tosuch problems involve the use of baffles extending from the top of theserver cabinet to the ceiling to try to prevent some of the mixingbetween the hot and cold air.

The maximum allowed temperature range for a server in a data center istypically 59 to 90 degrees Fahrenheit, while the recommended temperatureis typically between 68 and 77 degrees Fahrenheit. As the known datacenter storage solutions typically allow some mixing of air prior to theair reaching the electronic components, data centers typically pump coldair at between 55 and 60 degrees Fahrenheit to account for thetemperature increase in the air before it can act to cool thecomponents.

SUMMARY

In accordance with one aspect of the exemplary embodiments, a datacenter system can include a mobile suppm1 structure; one or moreenclosures for removable electronic equipment where the enclosures arehoused by the support structure; a cooling system in fluid communicationwith the enclosures for cooling of the electronic equipment where thecooling system is housed by the support structure; and a power systemoperably connected to the electronic equipment and the cooling systemfor supplying power thereto where the power system comprises a generatorhoused by the supp011 structure. The mobile data center is capable ofbeing moved to remote locations, and the electronic equipment is capableof being placed in communication with a network when at the remotelocation.

In accordance with another aspect of the exemplary embodiments, a datacenter system is provided that can include a mobile support structure; aplurality of cabinets that each form an enclosure for removableelectronic equipment where the cabinets are housed by the suppm1structure; and a cooling system in fluid communication with an innervolume of each of the cabinets for cooling of the electronic equipmentwhere the cooling system is housed by the suppo11 structure. The mobiledata center is capable of being moved to remote locations, and theelectronic equipment is capable of being placed in communication with anetwork when at the remote location.

In accordance with another exemplary embodiment, a data center systemcan include: a mobile support structure having wheels and capable ofbeing moved to a remote location; one or more cabinets formingenclosures for removable servers where the cabinets are housed by thesupport structure; a cooling system in fluid communication with thecabinets for cooling of the servers where the cooling system is housedby the support structure, where the cooling system comprises an airsupply channel, a cooling coil and a chiller, where the cooling coil isin t1uid communication with the chiller, where the air supply channelprovides air flow into the cabinet enclosures, where the cooling coil isin thermal contact with the air supply channel and where a coolant flowsthrough the cooling coil to remove heat from the air flowing through theair supply channel; and a control system comprising one or more sensorsand a controller, where the sensors are in proximity to the cabinets formonitoring at least one of a temperature, pressure and humidityassociated with the servers, and where the controller is incommunication with the sensors for receiving data from the sensors,where the controller adjusts at least one of the temperature, thepressure and the humidity associated with the servers, and where theservers are capable of being placed in communication with a network whenat the remote location.

In accordance with another exemplary embodiment, a method can include,but is not limited to, the steps of: providing a mobile supportstructure having wheels and capable of being moved to a remote location;installing servers in cabinets that are housed by the mobile supportstructure; moving the mobile support structure to the remote location;connecting the servers with a network when at the remote location; andmaintaining at least one of a temperature, a pressure and a humidityassociated with the servers within a desired range.

The above-described and other features and advantages of the presentdisclosure will be appreciated and understood by those skilled in theart from the following detailed description, drawings, and appendedclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a perspective schematic view of a mobile data centeraccording to arrangements of the present invention.

FIG. 1B is another perspective schematic view of a mobile data center.

FIG. 1C is a top schematic illustration of a housing of a mobile datacenter.

FIG. 1D is a side schematic illustration of a housing of a mobile datacenter.

FIG. 1E is a front schematic illustration of a housing of a mobile datacenter.

FIGS. 1F-I are schematic illustrations of a housing configuration of amobile data center.

FIGS. 1J-L are schematic illustrations of the housing of FIG. 1C.

FIG. 2 is a plan schematic view of a thermal management system forcabinets housing electronic equipment according to arrangements of thepresent invention.

FIG. 3 is a perspective isometric view of the thermal management cabinetof FIG. 2 with side panels removed.

FIG. 4 is a perspective isometric view of the thermal management cabinetof FIG. 2 with doors and baffles removed.

FIG. 5 is a side view of the thermal management cabinet of FIG. 2.

FIG. 6 is a perspective isometric view of the thermal management cabinetof FIG. 2, with servers removed.

FIG. 7 is a perspective isometric view of the interior components of thethermal management cabinet of FIG. 2.

FIG. 8 is a side perspective view of the interior components of thethermal management cabinet of FIG. 2, showing the foam door seal.

FIG. 9 is a side sectional view of the thermal management cabinet ofFIG. 2, showing example airflow patterns.

FIG. 10 is a front perspective view of another exemplary arrangement ofthermal management cabinet according to the invention.

FIG. 11 is a view showing the flexible fingers used in the thermalmanagement cabinet of FIG. 2.

FIG. 12 is a bottom view of a modular base for the thermal managementcabinet of FIG. 2.

FIG. 13 shows an exemplary embodiment of a perforated curtain for use inthe thermal management cabinet according to the present invention.

FIG. 14 is a side view showing an exemplary embodiment of airflow platesfor use in the thermal management cabinet according to the presentinvention.

FIG. 15 is a schematic illustration of another exemplary arrangement ofthermal management cabinet according to the invention.

DETAILED DESCRIPTION OF THE INVENTION

The exemplary embodiments of the present disclosure are described withrespect to an environmental management system for electronic equipment.It should be understood by one of ordinary skill in the art that theexemplary embodiments of the present disclosure can be applied to othertypes of management systems.

Referring to the drawings and in particular FIGS. 1A and 1B, anexemplary mobile data center system 5 is illustrated. The system 5 caninclude a support structure 15 which is capable of being moved tovarious locations, including remote locations, and then connected to anetwork at the new location, such as through a hardwire link, forproviding computer resources. In one embodiment, the support structure15 can be a trailer with wheels that is capable of being towed. Inanother embodiment, the support structure 15 can be a self-containedmoving vehicle; i.e., a drivable vehicle.

The system 5 can include a power sub-system having generator 20 thatprovides power to electronic equipment, such as servers, as well asother sub-systems, including a cooling system and a control system. Inone embodiment, the generator 20 can be a self-contained powergenerating device, such as a diesel generator. However, the presentdisclosure contemplates the use of other power supply devices, which mayor may not be connectable with outside power supply sources, such as thepower grid at the remote location. For example, the power sub-system canbe connectable with the power grid for receiving additional power asneeded. Other power supply sources that can be used to supplement orotherwise provide energy to system 5, can include solar power sources,wind power sources, hydrogen power sources and so forth.

Referring additionally to FIGS. 1C-E, in one embodiment, the system 5can comprise one or more housings 25 for the electronic equipment, whichmay have various points of access including rear and top pm1s or doors.In one embodiment, doors 30 can provide access to the inner volume ofthe housings 25 which can have a raised floor 35, such as a platformwith bar gratings. The raised floor 35 can provide access for electricalwiring, cooling conduit and the like to individual cabinets that housethe servers. The housings 25 can be configured in various ways includingcoaxially, such as in FIG. 1A or stacked on each other as in FIGS. IF-I.In another embodiment, the housing 25 can be formed using thermallyinsulated walls, including a non-perforated liner. Referringadditionally to FIGS. 1J-L, the housing 25 can include a number ofaccess panels 40. A lifting structure 45, such as a lift lug, can beprovided to facilitate positioning of the housing 25 with respect to thesupport structure 15.

The electronic equipment can be positioned in a plurality of cabinets 10(shown in FIG. 2) such as arranged in rows with access to the rows beingprovided by the doors 30, although the present disclosure alsocontemplates other configurations for the cabinets. The particularconfiguration of the rows can be selected based on a number of factors,including facilitating adjustment of environmental conditions associatedwith the cabinets and/or maximizing facility space.

In one embodiment, different housings 25 can have different requiredenvironmental conditions. For example, a first housing 25 can includecabinets 10 that are housing servers, which require a large amount ofcooling while a second housing includes cabinets housing routers thatrequire a smaller amount of cooling. By grouping the cabinets accordingto environmental requirements (e.g., desired temperature and humidityranges), system 5 can more efficiently control the environmentsassociated with the particular electronic equipment.

As described above, system 5 can include a cooling sub-system fordelivery of a cooling t1uid to each of the cabinets. The particularconfiguration of the cooling system, including the positioning of thevarious components, such as a chiller, conduits, fans and so forth, canvary. In one embodiment, the cooling t1uid can comprise air, such asdelivered through the use of pressurized plenums. The particular conduitconfiguration for delivery of the air to the cabinets 10 can vary. Forexample, an air supply channel can supply cooling air to multiplecabinets and/or multiple rows of cabinets. In one embodiment, eachcabinet can be connected directly to an air supply channel so that eachcabinet receives air that t1ows directly from the cooling subsystemrather than from another cabinet. In another embodiment, the cabinets 10can be arranged or grouped so that a portion of the cabinets receivecooling in series. For example, a first group of cabinets 10 requiring alarge amount of cooling can directly receive air that has been cooled bythe cooling subsystem. This cold air can t1ow across the electronicequipment of the first group of cabinets 10 and then can be directedtowards a second group of cabinets that require a smaller amount ofcooling. The air can then be returned to the cooling subsystem forremoval of the heat that has been transferred to the air by the firstand second groups of cabinets.

In one embodiment shown in FIG. 2, the cabinets 10 can have generallysolid side walls 112, a front 114 and a back 116. The cabinet 10 may beused to house a plurality of servers 15 or other pieces of electronicequipment, including routers, DSLAM's and so forth. Suitable dimensionsfor the cabinet 10 can vary depending on a number of factors includingthe type of electronic equipment, the facility space available, and thethermal management resources (e.g., the insulation factors, coolingpower and so forth) but can include a height of 7 feet, a width of 3feet and a depth of 4 feet.

Referring additionally to FIGS. 3-8, the cabinet 10 may includegenerally L-shaped horizontal rails 117 attached to, and supported by,four vertical rail supports 118 which form part of a frame 119 that ispositioned in the interior of the cabinet 10. A plurality of rails 117may be provided in pairs to form shelving brackets on which electroniccomponents can be supported. The rails may have any suitable formation,one suitable formation being standard square hole rails that may bepositioned 19″ apart to form a 19″ rack. The rails may be mounted to thevertical rail supports 118 and define the depth of the racks for housingthe electronic components 15.

The vertical rail supports 118 and the rails 117 can define anelectronic component storage area 120 that is located within the frame119. The positioning of the frame 119 can define a front service area121 forward of the frame to the front 114 of the cabinet, a rear servicearea 122 rearward of the frame to the back 116 of the cabinet 10. Twoside service areas 123 can be defined to the sides of the frame 119. Thecabinet 10 can be designed to be 42 U in height, with “U,” or rack unit,being a unit of measure used to describe the height of equipmentintended for mounting in a 19-inch rack or a 23-inch rack (the dimensionreferring to the width of rack). One rack unit can be 1.75″ (44.45 mm)high. Thus, a suitable number of rails 117 can be provided to equal thedesired height of the cabinet, with the rails being spaced a suitablenumber of rack units apart.

An insulated thermal management plate 124 can be provided, which can bemoved within the cabinet 10. The thermal management plate 124 can beformed of any suitable material. In one arrangement, the plate 124 canbe formed of ABS plastic with a foam insulation backing. The them1almanagement plate 124 can extend from the front 114 of the cabinet 10towards the back 116, typically to the rear vertical rail support 118which marks the front end of the rear service area 122. The electroniccomponents to be housed within the cabinet 10 can be stored within thecabinet, such as starting from the lowest rack and working upwards. Thethermal management plate 124 is easily movable within the cabinet and istypically placed within the cabinet 10 just above the height of thehighest electronic component that is stored within the cabinet 10. Theplate 124 may be attached to the rails 117 that are positioned directlyabove the top-most electronic component, or may simply be restedthereon. At the front edge of the thermal management plate 124, thecorners may be chamfered or cut off.

An insulated thermal curtain 125 can be provided at the back 116 of thecabinet 10. The thermal curtain 125 is preferably made of a compositematerial, though can be formed of any suitable material. The curtain 125can be suspended from a deployment device 126, such as a spring loadedor ratcheted roller mechanism that is attached at the top of the frame119. The curtain 125 can either be mounted within or adjacent to therear rail supports 118 such that it is located at the edge of the rearservice area 122. A bottom bracket 128 can enable the curtain 25 to beeasily raised and lowered. Typically, the curtain is lowered until it islevel with the thermal management plate 124. The curtain 125 can beformed of a thermal insulating material that prevents heat transfer.U-markings 130 may be provided on the curtain at 1.75″ intervals, alongwith a company logo for the cabinet manufacturer. With a 19″ rack width,the curtain 25 can be 20″ wide.

The curtain 125 can run in, or otherwise be guided by, vertical U-shapedrails attached to the vertical rail supports 118 such that the curtainprovides a generally sealed barrier to the transport of air. It shouldbe appreciated, that although the arrangement illustrated has curtain125 provided at the back 116 of the cabinet 10, it may alternatively orin addition be provided at the sides of the cabinet, and/or at only oneof the front, back or sides of the cabinet. In other arrangements, thethermal curtain 125 can be positioned at the front of the cabinet 10.

The thermal management plate 124 and the thermal curtain 125 can be usedto separate the interior space of the cabinet 10 into different zones byforming baffles to the air t1ow and heat transfer. A cold zone can bedefined within the front service area 121, bounded at the rear by theelectronic components that are stored within the racks and at the top bythe them1al management plate 124. The front door, the sides 112 and thebottom of the cabinet 10 can form the other boundaries of the cold zone.A hot zone can be defined within the rear service area 122, bounded atthe front by the electronic components that are stored within the racksand by the thermal curtain 125 that extends from the top of the cabinet10 to the thermal management plate 124. The sides 112, the rear door,the bottom and the top of the cabinet 10 can form the other boundariesof the hot zone. A neutral heat zone can be formed above the cold zone,defined between the top of the cabinet 10, the thermal management plate124, the sides 112 of the cabinet, the front door of the cabinet 10 andthe thermal curtain 125. Thus, the hot zone typically forms the entirevolume of the rear service area 122, while the front service area 121and the electronic component storage area 120 can be split vertically bythe horizontally-oriented plate 124 into the neutral heat zone at thetop and the cold zone at the bottom.

In one embodiment air flow within the cabinet 10 can go first from thecold zone rearwardly through the electronic component storage area 120where it becomes heated due to contact with the electronic componentstherein and exits into the hot zone. The air can then flow verticallyupwards within the hot zone to exit the cabinet. The neutral zone isdesigned to be cut off from this air flow by the thermal managementplate 124 and the thermal curtain 125. The neutral zone formed above thethermal management plate 124 can be used for storage for equipment suchas laptops or other devices.

In other arrangements, a thermal curtain 125 may be provided withoutprovision of a thermal management plate 124, in which case the thermalcurtain may be positioned to either the front or back of the storagearea 120, or at any location there between such as at the centerthereof. The thermal curtain 125 can be mounted to the top of thecabinet, and can be simply extended downwardly until it reaches thetop-most electronic component stored in the storage area 120. Thisarrangement thus splits the interior of the cabinet 10 into a hot zoneand a cold zone by vertically dividing the space using the thermalcurtain 125.

In yet other arrangements, as shown in FIGS. 9 and 10, the thermalmanagement plate 124 can extend from the front 114 of the cabinet to thefront ve1iical rail supports 118, and the thermal curtain 125 can beprovided close to the front vertical rail supports. This creates asmaller neutral heat zone but still performs the function of preventingthe cold zone from extending the full height of the cabinet 10 when theelectronic components are not necessarily stacked up to the top of thecabinet 10.

Referring additionally to FIGS. 11 and 12, adjacent to the vertical railsupports 118 at the front 114 and back 116 of the cabinet 10, aplurality of air management fingers 134 and/or brushes 135 can beprovided, which can extend to the sides or front/back of the cabinet 10.The fingers can be formed of a non-thermally conductive flexiblematerial, such as a foam, rubber or plastic material. The fingers 134can be generally rectangularly shaped and can be attached at one endonly to a support which is attached the rail supports 118. Each fingercan be separately moveable, and can allow cables to be passedtherethrough by pushing the cables in between adjacent fingers 134. Thebrushes 135 can be similarly arranged, attached at one end only to therail supports 118. In another embodiment, the brushes 135 can beprovided on supports on either side of the gap between the rail supports118 and the sides/front/back of the cabinet such that the brushes meetin the middle.

In one arrangement, a set of fingers 134 can extend from the railsupports 118 to the sides 112 of the cabinet at the rear edge of thefront service space 121. A set of brushes 135 can extend from the railsupports 118 to the rear 116 of the cabinet 112. The side service areas123 can thus be defined by the fingers 134 and brushes 135, such thatthey are bounded at the front by the fingers 134, at the sides by thesides 112 of the cabinet at the sides of the electronic componentsstored in the storage area 120 and the brushes 135, and at the rear bythe rear 116 of the cabinet. The side service areas 123 can thus begenerally separated from the airflow in the cabinet by the fingers 134and/or brushes 135, which form baffles, and the side service areas 123thus form secondary neutral heat zones. It will of course be appreciatedthat any arrangement of brushes and/or fingers can be employed to bothprovide a separation of the air flow from the side service areas 123 andstill to allow cables to be threaded into and through the side serviceareas 123 for appropriate cable management purposes.

In another arrangement, in place of or in addition to fingers 134 and/orbrushes 135, flexible foam insulation pieces 133 can be used. The foampieces may be provided in two parts: a generally thin rectangular piece133 a may be extended vertically from the cut corners of the thermalmanagement plate 124, and a generally triangular-section piece 133 b maybe attached to a door 136 of the cabinet. When the door 136 is closed,the two foam pieces 133 a and 133 b can abut one another. Cables canthen be run from the electronic components stored on the rack throughthe abutting foam pieces 133 a, 133 b, to the side service areas 123.The foam insulation pieces 133 can thus forn1 baffles between the coldzone and the neutral heat zone of the side service areas 123.

The sides 112 may each include one or more removable side panels toallow access between cabinets. The sides 112 and side panels may beconstructed of lightweight composite materials with non-thermalconductive properties. Insulation may also be provided on the sidepanels. In some arrangements, the sides 112 may include one or morepunch out panels so that cables may be run from servers stored in onecabinet 10 to servers stored in another cabinet 10. As the side serviceareas 123 are generally neutral air zones, it does not affect thecooling capabilities of the cabinet airflow to provide punch out holesin the sides.

The back 116 and the front 114 may both include one or more doors 136.The door 136 may have a side hinge, and may be constructed oflightweight composite materials similar to the sides 112, and may alsobe insulated. In one embodiment, a double door may be provided, whichhas the advantage of allowing a decrease in necessary aisle spacebetween cabinets that face one another. The door may include atemperature sensor that may be viewed without opening the door. Thetemperature sensor may be provided behind a window in the door, or mayhave a sensor part mounted inside the cabinet and a display part mountedon the outside of the door. The door may include a combination lock, orother locking mechanism. A rubber or other seal (not shown) may beprovided around the doors 136, to help to seal any air gaps that mightbe created.

In one embodiment, the cabinet 10 may be mounted on a modular base 137,fanning a bottom 138 of the cabinet. The base may measure 3′ wide by 4′long, and may allow access to a raised floor system 160 such as a TATE24″×24″ modular access floor system. A front section 140 of the base 137is open to the subfloor, and registers with corresponding openings thatare created to the raised floor system. A plurality of feet 142 areprovided to bear the weight of the cabinet. A skirt (not shown) maysurround the feet to prevent cool air from exiting around the base 137.

An airflow duct or chimney 144 may extend from a top 146 of the cabinet10. The duct 144 can extend generally from an area of the top 146 thatis adjacent to the back 116 of the cabinet. The duct 144 is dimensionedto extend into a ceiling space 162 such as an above-ceiling plenum forventing hot air to a venting means (not shown). The duct 144 may beflexible so that it can be easily connected to the ceiling even in theevent of imperfect positioning of the cabinet 10 below a vent panel intothe ceiling space 162. In one arrangement, the duct 144 can be formed ofa flexible fabric or plastic material. In another embodiment, the duct144 can be formed of a rigid material. The ceiling space 162 may be astandard drop ceiling system. Various components can be provided in thetop 146 such as a power raceway 147 and a public communications raceway148, both of which may be open to the room.

A divider 149 may divide the public communications raceway 148 for fiberand copper cables. A patch panel 150 can extend from the publiccommunications raceway into a private communications raceway 152 forpass through of cables into the interior of the cabinet 10. Dividers 153may be included in the private communications raceway 152 for dividingthe space for fiber and copper cables. Junction boxes 154 may beprovided in the power raceway 148 a for supply of power to the powercircuit in the cabinet. Power strips 156 and cable managers 158 may beprovided adjacent the back 116 of the cabinet 10. It will be appreciatedthat the arrangement of components at the top 146 of the cabinet 10 canbe varied to suit the particular application.

In use, the cabinet 10 can be installed over a raised access floor 160that is provided with cooled air from an HVAC or other system. The base137 can be registered with openings in the floor 160. The chimney can beextended into a drop ceiling 162. The electronic components can beinstalled on rails 117, and are appropriately cabled by passing cablesthrough the foam pieces 133, fingers 134 and/or brushes 135 into theside service areas 123. Standard cable management ladders may beemployed in the side service areas 123 to hold the cables at the rightheight and to allow them to be passed to the tops of the cabinet. Thecables are run to the top of the cabinet 10 for connection to the powersupply and to communications cables, which may be connected to otherservers using standard overhead ladder racks. The doors 136 are thenclosed.

As the electronic components are operated, they generate heat which isforced to the rear service area 122 by the airflow coming into the coldzone of the front service area 121 of the cabinet via the aperture 140at the front of the cabinet. The hot zone created in the rear servicearea 122 due to the heating effect of the electronic components causesthe air to flow up through the duct 144. The air thus circulates fromthe cold zone, through the electronic components in the storage area 120to the hot zone and up into duct 144. The various baffles such as thethermal management plate 124, them1al curtain 125 and foam pieces 133,fingers 134 and/or brushes 135 constrain the airflow into the smallestpossible space within the cabinet, and prevent hot and cold air mixingother than through the electronic component storage area 120.

In order to ensure that sufficient cool air is delivered to the uppermost electronic components, one or more flow diverters can optionally beused. For example, a perforated curtain 170 as shown in FIG. 13 or aseries of plates 172 as shown in FIG. 14, may be used. Such arrangementscan help to keep cool air flowing towards the top servers rather thanallowing it all to be directed to the lower servers.

In one exemplary embodiment, the cabinet enclosure can have an inlet andan outlet in proximity to a bottom portion of the cabinet enclosure. Asupply channel can be connected with the cabinet enclosure inlet. Thecabinet enclosure can be positioned on a floor and the supply channelcan be under the floor. An exhaust channel can be connected with thecabinet enclosure outlet. One or more plenums can be in fluidcommunication with at least one of the supply and exhaust channels. Theplenums can have a pressure source for generating a pressuredifferential through the enclosure of the cabinet enclosure causing airto flow therethrough. A cooling coil can be positioned under the floorand in thermal contact with the supply channel. A coolant can flowthrough the cooling coil to remove heat from the air flowing through thesupply channel.

In another exemplary embodiment, a the1mal management cabinet forelectronic equipment can include a cabinet frame having side walls anddefining a front, a back, a top and a bottom, where the cabinet forms agenerally sealed enclosure for electronic equipment. An electroniccomponent storage area including at least one shelving rack forsupporting electronic equipment can be defined in an interior section ofthe cabinet. At least one opening can be included in the top of thecabinet, and at least one opening can be included in the bottom of thecabinet. The cabinet can be dimensioned to extend between a raisedaccess floor of a building and a drop ceiling of a building, where theaccess floor carries cooled air and the drop ceiling venting heated air.The bottom opening of the cabinet can be alignable with an opening inthe access floor such that cool air from the access floor passes intothe cabinet and flows through the electronic component storage area toexit the cabinet through the top opening, which is alignable with anopening in the drop ceiling.

The cabinet interior can be separated into temperature zones comprisingat least a cold zone supplied with air from the bottom opening of thecabinet and a hot zone for venting through the top opening, with atleast one baffle provided to create the temperature zones such that airis directed to flow from the cold zone through the electronic componentstorage area to the hot zone. In one arrangement, the baffle cancomprise a thermal management plate that is positioned horizontally inthe cabinet above the electronic component storage area. The thermalmanagement plate can be formed of insulated material such as a plasticmaterial backed with an insulator.

In another arrangement, the baffle can comprise a heat transfer curtainthat is positioned vertically in the cabinet above the electroniccomponent storage area. The heat transfer curtain can be formed of acomposite material. In yet another arrangement, the baffle can beflexible and can allow cables to be passed through areas of the cabinetwhile providing a heat transfer barrier. The flexible baffle cancomprise at least one of flexible fingers, foam insulation and brushes.The flexible fingers and brushes can extend from the electroniccomponent storage area to at least one of the side walls, front and backof the cabinet. The at least one foam insulation can comprise twoflexible foam pieces positioned to allow cables to be passedtherebetween.

In another embodiment, a duct can extend from the top opening of thecabinet for connection to a drop ceiling. The duct can be formed of aflexible material such as a fabric material. At least one door can beprovided in at least one of the front and back of the cabinet. The atleast one door can be a double door. Insulation pieces can be providedadjacent at least one hinged edge of the at least one door. Theinsulation pieces can form a flexible baffle, and can comprise twoflexible foam pieces positioned to allow cables to be passedtherebetween. At least one side of the cabinet can include a removablepanel. At least one punch hole having a removable plug can be providedin at least one side of the cabinet. At least one airflow managementstructure can be provided adjacent to the bottom opening of the cabinet,which may be a perforated curtain.

In one embodiment as shown more clearly in FIG. 15, the cabinets 10 canbe in fluid communication with a pressurized plenum 1210. The particularnumber of plenums 1210 used can vary. For example, the system 5 canutilize a single plenum 1210 so that the pressure differential iscentrally generated. In another example, multiple pressurized plenums1210 can be utilized, such as one or more plenums being utilized foreach row. The plenum 1210 can have one or more pressure sources, such asfan 1215, although other pressure sources are also contemplatedincluding pumps and the like.

In one embodiment, the fan 1215 can be a centrifugal fan. The fan 1215can include noise-absorption components and anti-vibration mountingcomponents. Various filters and other components can be utilized incombination with the fan. In one embodiment, the fan 1215 can be anadjustable speed fan to increase or decrease the pressure in the plenum1210. For example, the fan 1215 can be a variable frequency drive fan.In another embodiment, a plurality of fans 1215 can be in communicationwith the pressurized plenum 1210 so that the pressure can be increasedby operating additional fans of the plurality of fans. The presentdisclosure also contemplates the fan configuration being modular. Forinstance, the fans 1215 can be easily added to the plenums, such as byremoving a blocking plate that seals a wall of the plenum in the absenceof the fan.

The cabinets 10 can be bound on a first side by a cold zone 1110 andbound on a second side by a hot zone 1111. In the exemplary embodimentshown, the cold and hot zones 1110 and 1111 are access areas that havedoors 1105 so that technicians can access the cabinets when needed (suchas for adding or removing the electronic equipment). However, thepresent disclosure also contemplates the cold and hot zones 1110, 1111being integrally formed with the cabinets 10 and/or defined by aninsulated false wall between the access areas and the cabinets. In theexemplary embodiment of FIG. 15, each cabinet in a row share a cold zone1110 and a hot zone 1111. However, the present disclosure contemplatesother configurations of cold and hot zones 1110, 1111, such asindividual cabinets or groups of cabinets in a single row having theirown cold and hot zones. Adjacent hot and cold zones 1111, 1110 can beseparated by a wall 1115.

The pressurized plenum 1210 can generate a pressure differential betweenthe cold zone 1110 and the hot zone 1111 thereby causing air to flowacross the electronic equipment in the cabinets 10 which removes heatfrom said equipment. The number and configuration of plenums that areutilized to generate the desired pressure differential can vary based ona number of factors, including the type of electronic equipment that isbeing environmentally managed. For example, a plurality of plenums 1210can be in fluid communication with the cold and hot zones 1110, 1111 ofeach row. The pressurized plenums can generate positive pressure and/ornegative pressure to create the desired pressure differential andthereby create air flow over the electronic equipment. For instance, afirst pressurized plenum can generate a positive pressure (e.g., adesired pressure above ambient) in proximity to the cold zone 1110,while a second pressurized plenum generates a negative pressure (e.g., avacuum) in proximity to the hot zone 1111.

In one embodiment, the use of pressurized plenums 1210 allows system 5to isolate fans from the electronic equipment. For example, thepressurized plenums 1210 can increase air pressure using pumps so thatthe system does not utilize any fans. In another example, the pressureincrease can result from the use of fans that are positioned remotelyfrom the cabinets so that air flow from the fans does not directlycontact the electronic equipment (e.g., the fans create air flow withinthe plenum that results in an increased pressure in the plenum which isin turn communicated to the cabinets).

The air passing over the electronic equipment is utilized to remove heatfrom the equipment. In turn, the cooling subsystem can then remove theheat from the air. In one embodiment, the cooling subsystem can be avapor-compression cycle system, although other systems are alsocontemplated by the present disclosure. The subsystem can include a pumpand one or more chillers for cooling water or other coolant (e.g.,chilled liquid settings between 15 and 50 degrees Fahrenheit) which isthen supplied to coils via supply lines and return lines. The coils 1175can be positioned in thermal communication with the hot zone 1111. Forexample, the coil 1175 can be positioned under the floor 160 so that theair coming from hot zone 1111 passes through the coil 1175 then throughthe pressurized plenum 1210 and back into the cold zone 1111. Theparticular number and configuration of coils 1175 that are utilized canvary based on a number of factors, including the number of pressurizedplenums and configuration of the cold and hot zones that are beingutilized. For example, each row of cabinets 10 can have sixequidistantly positioned pressurized plenums 1210 under the floor 160with a coil 1175 in thermal communication with each of the plenums(e.g., positioned downstream of the hot zone 1111 and upstream of thecold zone 1110 for each plenum).

To control the environment surrounding the electronic equipment, acontroller 1180 can be utilized. The controller can be a machine withinwhich a set of instructions, when executed, may cause the machine toperform any one or more of the methodologies discussed herein. In someembodiments, the machine can operate as a standalone device. In someembodiments, the machine may be connected (e.g., using a network) toother machines. In a networked deployment, the machine may operate inthe capacity of a server or a client user machine in server-client usernetwork environment, or as a peer machine in a peer-to-peer (ordistributed) network environment. The machine may comprise a servercomputer, a client user computer, a personal computer (PC), a tablet PC,a laptop computer, a desktop computer, a control system, or any machinecapable of executing a set of instructions (sequential or otherwise)that specify actions to be taken by that machine. Further, while asingle machine is illustrated, the term “machine” shall also be taken toinclude any collection of machines that individually or jointly executea set (or multiple sets) of instructions to perform any one or more ofthe methodologies discussed herein.

The controller 1180 can be in communication with one or more sensors forreceiving environmental information associated with the electronicequipment. For example, one or more temperature sensors 1225 and one ormore pressure sensors 1235 can be positioned with respect to theelectronic equipment so that the sensors can capture environmentalinformation and transmit the information to the controller 1180. Theparticular positioning of the sensors can vary. For instance,temperature sensors 1225 can be placed both upstream and downstream ofthe coil 1175 so that the cooling efficiency of the coil can be easilymonitored, while other temperature sensors can be placed in closeproximity to the electronic equipment so that the amount of heat beinggenerated by the electronic equipment can be more easily monitored. Thepressure sensors 1235 can be placed both upstream and downstream of thepressurized plenum 1210 so that the pressure differential can be moreeasily monitored. The type of sensor used to capture the environmentalinformation can also vary, including pressure and temperaturetransducers and thermocouples.

In one embodiment, other sensors can also be used to further monitor theenvironmental conditions associated with the electronic equipment, suchas humidity sensors 1240 and flow sensors 1245. The humidity sensors1240 allow the controller 1180 to monitor the humidity that theelectronic equipment is being exposed to and to adjust the humidityaccordingly, such as through use of a de-humidifier 1112 that is influid communication with the electronic equipment. The flow sensors 1245allow the controller 1180 to monitor the flow rate of air, such as fordetermining heat transfer via convection. The use of flow sensors 1245can also be used for determining other environmental characteristics,such as air flow turbulence, that can have an adverse impact on thecooling of the electronic equipment or the equipment itself.

The sensors can communicate with the controller 1180 via hardwire (e.g.,cables 1181) and/or wireless links 1182. The particular communicationprotocols that are utilized can vary and can include Wireless Fidelityor WiFi services, Bluetooth, GSM, CDMA, UMTS, WiMAX, and so forth. Acombination of communication techniques can also be utilized, such asallowing the sensors to communicate both wirelessly and via hardwire toprovide redundancy so that data is not lost in the event of a linkfailure.

The controller 1180 can receive the environmental information from thesensors and adjust the environmental conditions accordingly. In oneembodiment, each of the cabinets 10 can have a range of environmentalconditions that are acceptable. In real time, the controller 1180 canreceive the environmental information associated with each of thecabinets 10 and then in real time can adjust one or more of thetemperature, pressure and humidity associated with the cabinets.

For example, the controller 1180 can determine that a first cabinet 10needs to lower its temperature by a desired amount. The controller 1180can then transmit control signals for making the appropriate adjustmentto achieve the desired temperature change. For instance, the controller1180 can transmit a control signal to the cooling subsystem to increasecoolant flow to the coil 1175 that is associated with the particularcabinet or to decrease the temperature of the coolant that is beingprovided to the coil. In one embodiment, the controller 1180 cantransmit a control signal to the cooling subsystem which designated adesired temperature and the subsystem can then implement the necessarysteps to achieve the desired temperature. As another example, thecontroller 1180 can transmit a control signal to the pressurized plenumthat is associated with the particular cabinet so that the pressuredifferential is increased thereby increasing the air flow through theparticular cabinet. In one embodiment, the controller 1180 canindependently utilize the pressurized plenum 1210 and the coolingsubsystem to adjust the temperature associated with a particularcabinet. In another embodiment, the controller 1180 can utilize both ofthe pressurized plenum 1210 and the cooling subsystem to adjust thetemperature associated with a particular cabinet.

As another example, the controller 1180 can determine that a firstcabinet 10 needs to decrease its air flow rate through the cabinet 10 adesired amount. The controller 1180 can then transmit control signalsfor making the appropriate adjustment to achieve the desired air flowrate. For instance, the controller 1180 can transmit a control signal tothe pressure source 1215 of the pressurized plenum to decrease thepressure within the plenum that is associated with the particularcabinet. In one embodiment, a damper 1120 can be utilized for air flowcontrol. For instance, the damper 1120 can be positioned downstream ofthe pressurized plenum 1210 and opened or closed using an actuator 1122(e.g., a servo-motor or other movable control device). In this example,the controller 1180 can restrict air flow to the particular cabinet bysending control signals to the actuator 1122 which results in the dampermoving towards a closed position.

Controller 1180 can also utilize historical information to provideenvironmental management for the cabinets 10. For example, thecontroller 1180 can monitor the temperature of particular cabinets basedon particular times of the day and adjust the environmental conditionsof the cabinets in anticipation of those temperatures. For instance,historical data may show that electronic equipment in a particularcabinet is typically being used to capacity during the morning with aresulting elevation of cabinet temperature during those morning hours.The controller 1180 can adjust the temperature in the particular cabinetto a lower portion of the desired range in anticipation of the increasedtemperature in the morning. The historical data can be maintained in amemory of the controller 1180 or can be stored elsewhere and retrievedby the controller.

Controller 1180 can also maintain historical information associated withthe efficiency of the thermal control being implemented by thecontroller. For example, the controller 1180 can implement severaldifferent techniques for achieving a desired environmental condition andcompare the techniques to determine which was the most efficient. Forinstance, where a temperature decrease is needed, the controller 1180can on a first occasion utilize an increase in pressure differential toachieve the lower temperature. On a second occasion, the controller 1180can utilize the cooling subsystem to achieve the lower temperature. Thecontroller 1180 can then determine efficiency based on such factors asthe amount of time needed to achieve the lower temperature, the amountof power utilized in achieving the lower temperature and so forth. Inthis example, the controller 1180 can then utilize this historicalinformation to determine which thermal management techniques should beutilized in the future based on the particular circumstances.

In one embodiment, other factors can also be analyzed by the controller1180 for determining the particular technique to utilize to achieve thedesired environmental condition. For instance, vibration or noise can bemonitored with respect to the use of certain components of the system 5and the amount of vibration or noise can be a factor in determiningwhich technique (e.g., which cooling components) should be utilized.

The methodology and techniques described with respect to the exemplaryembodiments can be performed using a machine or other computing devicewithin which a set of instructions, when executed, may cause the machineto perform any one or more of the methodologies discussed above. In someembodiments, the machine operates as a standalone device. In someembodiments, the machine may be connected (e.g., using a network) toother machines. In a networked deployment, the machine may operate inthe capacity of a server or a client user machine in server-client usernetwork environment, or as a peer machine in a peer-to-peer (ordistributed) network environment. The machine may comprise a servercomputer, a client user computer, a personal computer (PC), a tablet PC,a laptop computer, a desktop computer, a control system, a networkrouter, switch or bridge, or any machine capable of executing a set ofinstructions (sequential or otherwise) that specify actions to be takenby that machine. Further, while a single machine is illustrated, theterm “machine” shall also be taken to include any collection of machinesthat individually or jointly execute a set (or multiple sets) ofinstructions to perform any one or more of the methodologies discussedherein.

The machine may include a processor (e.g., a central processing unit(CPU), a graphics processing unit (GPU, or both), a main memory and astatic memory, which communicate with each other via a bus. The machinemay further include a video display unit (e.g., a liquid crystal display(LCD), a flat panel, a solid state display, or a cathode ray tube(CRT)). The machine may include an input device (e.g., a keyboard), acursor control device (e.g., a mouse), a disk drive unit, a signalgeneration device (e.g., a speaker or remote control) and a networkinterface device.

The disk drive unit may include a machine-readable medium on which isstored one or more sets of instructions (e.g., software) embodying anyone or more of the methodologies or functions described herein,including those methods illustrated above. The instructions may alsoreside, completely or at least primarily, within the main memory, thestatic memory, and/or within the processor during execution thereof bythe machine. The main memory and the processor also may constitutemachine-readable media.

Dedicated hardware implementations including, but not limited to,application specific integrated circuits, programmable logic arrays andother hardware devices can likewise be constructed to implement themethods described herein. Applications that may include the apparatusand systems of various embodiments broadly include a variety ofelectronic and computer systems. Some embodiments implement functions intwo or more specific interconnected hardware modules or devices withrelated control and data signals communicated between and through themodules, or as portions of an application-specific integrated circuit.Thus, the example system is applicable to software, firmware, andhardware implementations.

In accordance with various embodiments of the present disclosure, themethods described herein are intended for operation as software programsrunning on a computer processor. Furthermore, software implementationscan include, but not limited to, distributed processing orcomponent/object distributed processing, parallel processing, or virtualmachine processing can also be constructed to implement the methodsdescribed herein.

The present disclosure contemplates a machine readable medium containinginstructions, or that which receives and executes instructions from apropagated signal so that a device connected to a network environmentcan send or receive voice, video or data, and to communicate over thenetwork using the instructions. The instructions may further betransmitted or received over a network via the network interface device.

While the machine-readable medium is shown in an example embodiment tobe a single medium, the term “machine-readable medium” should be takento include a single medium or multiple media (e.g., a centralized ordistributed database, and/or associated caches and servers) that storethe one or more sets of instructions. The term “machine-readable medium”shall also be taken to include any medium that is capable of storing,encoding or carrying a set of instructions for execution by the machineand that cause the machine to perform any one or more of themethodologies of the present disclosure.

The term “machine-readable medium” shall accordingly be taken toinclude, but not be limited to: solid-state memories such as a memorycard or other package that houses one or more read-only (non-volatile)memories, random access memories, or other re-writable (volatile)memories; magneto-optical or optical medium such as a disk or tape; orother self-contained information archive or set of archives isconsidered a distribution medium equivalent to a tangible storagemedium. Accordingly, the disclosure is considered to include any one ormore of a machine-readable medium or a distribution medium, as listedherein and including art-recognized equivalents and successor media, inwhich the software implementations herein are stored.

Although the present specification describes components and functionsimplemented in the embodiments with reference to pm1icular standards andprotocols, the disclosure is not limited to such standards andprotocols. Each of the standards for Internet and other packet switchednetwork transmission (e.g., TCP/IP, UDPIIP, HTML, HTTP) representexamples of the state of the art. Such standards are periodicallysuperseded by faster or more efficient equivalents having essentiallythe same functions. Accordingly, replacement standards and protocolshaving the same functions are considered equivalents.

The illustrations of arrangements described herein are intended toprovide a general understanding of the structure of various embodiments,and they are not intended to serve as a complete description of all theelements and features of apparatus and systems that might make use ofthe structures described herein. Many other arrangements will beapparent to those of skill in the art upon reviewing the abovedescription. Other arrangements may be utilized and derived therefrom,such that structural and logical substitutions and changes may be madewithout departing from the scope of this disclosure. Figures are alsomerely representational and may not be drawn to scale. Certainproportions thereof may be exaggerated, while others may be minimized.Accordingly, the specification and drawings are to be regarded in anillustrative rather than a restrictive sense.

Thus, although specific arrangements have been illustrated and describedherein, it should be appreciated that any arrangement calculated toachieve the same purpose may be substituted for the specific arrangementshown. This disclosure is intended to cover any and all adaptations orvariations of various embodiments and arrangements of the invention.Combinations of the above arrangements, and other arrangements notspecifically described herein, will be apparent to those of skill in theart upon reviewing the above description. Therefore, it is intended thatthe disclosure not be limited to the particular arrangements(s)disclosed as the best mode contemplated for carrying out this invention,but that the invention will include all embodiments and arrangementsfalling within the scope of the appended claims.

The Abstract of the Disclosure is provided to comply with 37 C.F.R.§1.72(b), requiring an abstract that will allow the reader to quicklyascertain the nature of the technical disclosure. It is submitted withthe understanding that it will not be used to interpret or limit thescope or meaning of the claims.

1. A data center system comprising: a housing for removable electronicequipment; a cooling system in fluid communication with an inner volumeof the housing for cooling the electronic equipment; wherein the datacenter system is capable of being moved to remote locations; a cabinetwithin the housing, wherein the cabinet has an inlet and an outlet; asupply channel connected with the cabinet inlet; an exhaust channelconnected with the cabinet outlet; one or more plenums in fluidcommunication with at least one of the supply and exhaust channels; anda sensor for sensing environmental data associated with at least one ofthe housing and the cabinet.
 2. The data center system of claim 1,wherein the sensor sends the environmental data to a controller.
 3. Thedata center system of claim 1, wherein, based upon environmental datathe controller causes an adjustment to at least one of a temperature, apressure and a humidity associated with at least one of the house andthe cabinet.
 4. The data center system of claim 3, wherein thecontroller causes the adjustment in real time.
 5. The data center systemof claim 3, further comprising the controller.
 6. The data center systemof claim 1, wherein the environmental data comprises at least one of atemperature, a pressure and a humidity.
 7. The data center system ofclaim 1, wherein the electronic equipment is capable of being placed incommunication with a network when at the remote location.
 8. The datacenter system of claim 1, a damper connected with the air supplychannel, wherein the damper has a damper actuator connected thereto, andwherein the damper can be opened and closed based on signals transmittedfrom the controller to the damper actuator.
 9. The data center system ofclaim 1, wherein the cooling system comprises one or more plenums influid communication with the air supply channel, wherein the one or moreplenums have a pressure source for generating a pressure differentialthrough the housing causing air to flow therethrough.
 10. The datacenter system of claim 1, wherein the sensor comprises a plurality ofsensors in proximity to the electronic equipment for monitoring at leastone of a temperature, pressure and humidity associated with theelectronic equipment.
 11. The data center system of claim 1, furthercomprising a mobile support structure, wherein the housing is disposedon the mobile support structure and the mobile support structurecomprises a trailer capable of being towed to the remote location. 12.The data center system of claim 1, wherein the cooling system is atleast partially housed by the housing.
 13. A modular data center systemcomprising: a module for housing removable electronic equipment; acooling system in fluid communication with an inner volume of thehousing for cooling of the electronic equipment; wherein the data centersystem is capable of being moved to remote locations; a cabinet withinthe module that forms an enclosure, wherein the cabinet has an inlet andan outlet; a supply channel connected with the cabinet inlet; an exhaustchannel connected with the cabinet outlet; one or more plenums in fluidcommunication with at least one of the supply channel and the exhaustchannel; a cooling coil, wherein a coolant flows through the coolingcoil to remove heat from the air flowing through the supply channel; asensor in proximity to the cabinets for sensing environmental dataassociated with the electronic equipment, wherein the sensor sends theenvironmental data to a controller.
 14. The data center system of claim13, wherein the environmental data comprises at least one oftemperature, pressure, humidity and security data and wherein, basedupon the environmental data, the controller causes an adjustment of atleast one of a temperature, a pressure, a humidity and a securitycontrol associated with the electronic equipment.
 15. The data centersystem of claim 13, wherein the cooling system is at least partiallyhoused by the module.
 16. The data center system of claim 13, whereinthe inlet is in proximity to a bottom portion of the cabinet, andwherein the outlet is in proximity to a top portion of the cabinet. 17.The data center system of claim 13, wherein the one or more plenums havea pressure source for generating a pressure differential through theenclosure of the cabinet.
 18. The data center system of claim 17,wherein the one or more plenums cause air to flow through the enclosure.19. The data center system of claim 13, wherein the cabinet ispositioned on a floor in the module and the supply channel is under thefloor.
 20. The data center system of claim 13, wherein the cooling coilis positioned under the floor and in thermal contact with the supplychannel.